| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method of manufacturing an electronic component module that can reliably shield an electronic component and that can be miniaturized so that it is made less tall; and an electronic component module that is manufactured using the manufacturing method. SOLUTION: An aggregate board 10 on which a plurality of electronic component modules 1 are formed by containing a plurality of electronic components is sealed with a resin, and cuts are made from the top face of the sealing resin between the electronic component modules 1 to form side face sections 17 for each of the electronic component modules 1. A sheet of conductive resin 18 is placed in such a way as to cover the top faces of the electronic component modules. An elastic body (deformable material) 20 is placed on the conductive resin 18, and pressure or both pressure and heat are applied to the conductive resin 18 via the deformable material placed, whereby at least a portion of the side face and the top face of each electronic component module 1 is covered with the conductive resin 18. The conductive resin 18 is cut between the electronic component modules 1 into separate pieces each being a single electronic module 1. COPYRIGHT: (C)2011,JPO&INPIT |
