| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of forming a conductive structural part having a thickness of several micrometers and an annealing temperature of metal nanoparticles of about 130°C or lower. <P>SOLUTION: The method is for forming a conductive structural portion on a substrate and includes a process, in which a metal compound is reacted with a reducing agent under existence of a stabilizer in a reaction mixture of non-solvent in a substance containing the metal compound the reducing agent, and the stabilizer and a plurality of metal nanoparticles having molecules of the stabilizer on the surface of the metal nanoparticles are formed. After the plurality of metal nanoparticles having the molecules of the stabilizer on the surface of the metal nanoparticles are separated, a liquid composition containing a polymer binder, liquid, and the plurality of metal nanoparticles having the molecules of the stabilizer on the metal nanoparticle surface is deposited on the substrate by a liquid deposition technology, to form a deposited composition. The deposited composition is then heated, and the conductive structural part is formed on the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
