| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition, capable of obtaining a resist film which is less likely to have discoloration, such as yellowing, even when exposed to a high temperature of about 200°C or higher, at solder reflow. <P>SOLUTION: The photosensitive composition includes at least one of a polymerizable hydrocarbon monomer (A) and a polymerizable hydrocarbon polymer (B) and an inorganic filler (C), wherein the inorganic filler (C) shows pH 6.8-11, when a liquid prepared by adding 5 g of the inorganic filler (C) to 100 mL of pure water is heated, boiled for 5 min and allowed to stand, until it achieves 23°C, to obtain a boiling treated liquid; water is added to the boiling treated liquid in an amount of water evaporated by the boiling; and the pH of the resulting liquid containing 100 mL of water is measured. <P>COPYRIGHT: (C)2011,JPO&INPIT |
