发明名称 |
MICROELECTRONIC DEVICE, IN PARTICULAR BACK SIDE ILLUMINATED IMAGE SENSOR, AND PRODUCTION PROCESS |
摘要 |
A process for producing a microelectronic device includes producing a first semiconductor substrate which includes a first layer and a second layer present between a first side and a second side of the substrate. First electronic components and an interconnecting part are produced on and above the second side. The substrate is then thinned by a first selective etch applied from the first side and stopping on the first layer followed by a second selective etch stopping on the second layer. A second substrate is attached over the interconnecting part. The electronic components may comprise optoelectronic devices which are illuminated through the second layer.
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申请公布号 |
US2011140220(A1) |
申请公布日期 |
2011.06.16 |
申请号 |
US20100963792 |
申请日期 |
2010.12.09 |
申请人 |
STMICROELECTRONICS S.A.;STMICROELECTRONICS (CROLLES2) SAS |
发明人 |
MARTY MICHEL;DUTARTRE DIDIER;ROY FRANCOIS;BESSON PASCAL;PRIMA JENS |
分类号 |
H01L31/0236;H01L31/0232;H01L31/18 |
主分类号 |
H01L31/0236 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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