HOT MELT ADHESIVE TAPE AND A PRODUCTION METHOD THEREFOR, A METHOD FOR CONNECTING ELECTRONIC EQUIPMENT USING THE SAME AND A CONNECTING DEVICE THEREFOR, AND ELECTRONIC EQUIPMENT OF THIS TYPE

摘要

The present invention relates to: a hot melt adhesive tape which can be used on diverse materials and can provide high adhesion reliability, and which can be melted and adhered by means of a frequency and particularly high-frequency waves; and a production method therefor. More specifically, it relates to: an adhesive tape in which a hot-melting adhesive layer is provided with an electrically conductive body and in particular conductive aluminium foil, and which provides an adhesive force when the hot-melting layer is melted by heating the electrically conductive body on applying a high frequency; and a production method therefor. The hot-melt adhesive tape according to the present invention comprises: an electrically conductive body; and a hot-melting adhesive layer disposed on one surface or both surfaces of the aluminium foil.