| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering device reducing power consumption and the size and mixedly producing plural kinds of printed boards. SOLUTION: The reflow soldering device 1 includes a conveyor 6 for conveying the printed board 3, and first and second preheating heaters 8 and 9, vertically mounted movably to a conveying part for the conveyor 6 to preheat the printed board 3, and the reflow soldering device 1 further includes a reflow-heating heater 10 mounted on the reverse side to the carry-in side of the printed board 3 for the second preheating heater 9 and vertically installed movably to the conveying section for the conveyor 6 for reflow-heating the printed board 3. COPYRIGHT: (C)2011,JPO&INPIT
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