发明名称 Methods and systems for thermal-based laser processing a multi-material device
摘要 A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
申请公布号 US7955905(B2) 申请公布日期 2011.06.07
申请号 US20060643023 申请日期 2006.12.20
申请人 GSI GROUP CORPORATION 发明人 CORDINGLEY JAMES J.;EHRMANN JONATHAN S.;FILGAS DAVID M.;JOHNSON SHEPARD D.;LEE JOOHAN;SMART DONALD V.;SVETKOFF DONALD J.
分类号 H01L21/00;B23K26/00;B23K26/02;B23K26/03;B23K26/04;B23K26/06;B23K26/067;B23K26/073;B23K26/08;B23K26/36;B23K26/38;B23K26/40;B23K101/40;G11C29/04;H01L21/304;H01L21/48;H01L21/66;H01L21/768;H01L21/82;H01L23/525;H05K3/00 主分类号 H01L21/00
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