A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.
申请公布号
WO2011028644(A3)
申请公布日期
2011.06.03
申请号
WO2010US47078
申请日期
2010.08.30
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;HAAS, ROBERT;GARANT, JOHN;PALMATIER, PHIL;LEENSTRA, BOUWE