| 摘要 |
PURPOSE: A stacked semiconductor package is provided to prevent an interconnection defect by obtaining flexibility on a connection part between a top package and a bottom package through a conductive connection member. CONSTITUTION: A bottom package(200) includes a ball land. A top package(100) includes an external connection terminal electrically connected to the ball land on one side facing the ball land of the bottom package. The external connection terminal includes a solder ball. A conductive connection member(300) has a flexible property to electrically and physically connect the ball land to the external connection terminal. |
