发明名称 Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same
摘要 A first clad (504) layer is formed on a smooth support substrate (559) via a release layer (531). On the first clad layer (504), a core (501) through which light propagates and alignment marks (507, 515) are simultaneously formed. Further, these layers are covered with a second clad (506) to obtain an optical wiring layer (51). Then, the optical wiring layer (51) is released from the support substrate (559) and stuck to a substrate (52) having an electric wiring (519). Subsequently, on the resulting optical wiring layer is formed a mirror (505, 512) for reflecting light propagating through the core (501), pads (509, 510) for installing optical parts (58, 59)or the like, and via holes (523) for electrically connecting the electric wiring (519) on the substrate (52) to the pads (509, 510). For this formation, the alignment marks (507, 515) are used as references. <IMAGE>
申请公布号 EP1041418(B1) 申请公布日期 2011.06.01
申请号 EP20000106748 申请日期 2000.03.29
申请人 TOPPAN PRINTING CO., LTD. 发明人 TSUKAMOTO, TAKEHITO;KUMAI, KOICHI;MINATO, TAKAO;HIRAYAMA, SHIGERU;ODE, MASAYUKI
分类号 G02B6/42;H05K1/18;G02B6/13;G02B6/138;G02B6/43;H05K1/02 主分类号 G02B6/42
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