| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate having conductivity almost equal to that of a conventional metal thin film and enhanced in the adhesiveness with a substrate, its manufacturing method and a method for forming the metal thin film on the substrate without requiring a high temperature. SOLUTION: The laminate comprises the metal thin film having a structure wherein, an insulating substrate, the insulating resin layer, which has an imide bond and/or an amide bond, formed on the insulating substrate and metal fine particles with a particle size of 200 nm or below formed on the insulating resin layer are fused mutually. COPYRIGHT: (C)2006,JPO&NCIPI |
