| 摘要 |
<p>The jet-type solder system useful as a beam solder application device that is provided with a jet nozzle, where a size of a soldered place of a workpiece (W) to be soldered is changed related to a beam width, is claimed. The beam solder application device and the workpiece are designed in order to move relative in a predetermined direction and in order to form a solder region through the beam width of the solder on the workpiece. The jet nozzle is rotatably arranged in the beam solder application device around an axis of a beam direction. The jet-type solder system useful as a beam solder application device that is provided with a jet nozzle, where a size of a soldered place of a workpiece (W) to be soldered is changed related to a beam width, is claimed. The beam solder application device and the workpiece are designed in order to move relative in a predetermined direction and in order to form a solder region through the beam width of the solder on the workpiece. The jet nozzle is rotatably arranged in the beam solder application device around an axis of a beam direction. A solder part grips the beam solder application device in order to move the soldered place of the workpiece to be soldered within predetermination areas. The jet nozzle is provided with a nozzle bore to a flat hole form, which is rotated and adapted in order to concur the soldered place of the workpiece to be soldered with a solder width. An independent claim is included for a printed circuit plate-manufacturing system.</p> |
