发明名称 METHOD OF FABRICATING SUBSTRATE FOR PACKAGE OF SEMICONDUCTOR LIGHT-EMITTING DEVICE
摘要 IN THE INVENTION, A SUBSTRATE (1) AND FABRICATION THEREOF FOR A PACKAGE OF AT LEAST ONE SEMICONDUCTOR DEVICE, SUCH AS SEMICONDUCTOR LIGHT-EMITTING DEVICES, ARE DISCLOSED. IN PARTICULAR, A BASE (11) TOGETHER WITH A FRAME SUPPORTING THE BASE (11) OF THE SUBSTRATE (1) ACCORDING TO THE INVENTION IS FORMED OF A THICK-WALLED METAL MATERIAL, A SPECIAL-SHAPED METAL PLATE OR A NORMAL-SHAPED METAL PLATE. THE AT LEAST ONE SEM ICONDUCTOR DEVICE IS TO MOUNTED ON A TOP SURFACE OF THE BASE (11). MOREOVER, THE BASE (11) SERVES AS A HEAT SINK.
申请公布号 MY143480(A) 申请公布日期 2011.05.31
申请号 MY2006PI01012 申请日期 2006.03.09
申请人 I-CHIUN PRECISION INDUSTRY CO., LTD. 发明人 CHOU, WAN-SHUN
分类号 H01L23/34 主分类号 H01L23/34
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