摘要 |
IN THE INVENTION, A SUBSTRATE (1) AND FABRICATION THEREOF FOR A PACKAGE OF AT LEAST ONE SEMICONDUCTOR DEVICE, SUCH AS SEMICONDUCTOR LIGHT-EMITTING DEVICES, ARE DISCLOSED. IN PARTICULAR, A BASE (11) TOGETHER WITH A FRAME SUPPORTING THE BASE (11) OF THE SUBSTRATE (1) ACCORDING TO THE INVENTION IS FORMED OF A THICK-WALLED METAL MATERIAL, A SPECIAL-SHAPED METAL PLATE OR A NORMAL-SHAPED METAL PLATE. THE AT LEAST ONE SEM ICONDUCTOR DEVICE IS TO MOUNTED ON A TOP SURFACE OF THE BASE (11). MOREOVER, THE BASE (11) SERVES AS A HEAT SINK. |