| 摘要 |
<p>PURPOSE: A light emitting diode package and a light emitting module are provided to improve the all reliability of light emitting module connected to the light emitting diode package by remarkably reducing the defect rate of the light emitting diode package according to the pad defect. CONSTITUTION: A second lead frame(32) is electrically insulated with a first lead frame(31). The first lead frame is installed with a light emitting diode chip(10). The light emitting diode chip comprises a first pad(11), a second pad(12), and a third pad(13). The first pad and the second pad are electrically connected to the first lead frame.</p> |
