SEMICONDUCTOR MANUFACTURING APARTUS AND SEMICONDUCTOR MANUFACTURING METHOD BY USING THE SAME

摘要

PURPOSE: A semiconductor manufacturing apparatus and a semiconductor manufacturing method by using the same are provided to reduce time delay of transferring a target between apparatus to shorten TAT by processing a process of forming a protective film in a wafer edge and a process of etching a via hole. CONSTITUTION: In a semiconductor manufacturing apparatus and a semiconductor manufacturing method by using the same, a chamber(10) offers a process space. A wafer stand(20) supports a wafer(W). An injection nozzle(30) is installed in the upper part of a chamber to inject chemical to the wafer. A cover shield(41) has a size and a form covering the upper center(C) of the wafer. A moving shaft(42) transfers the cover shield to the top side of the wafer.