发明名称 |
LIGHT EMITTING DIODE LAMP BAR AND MANUFACTURE METHOD THEREOF, LIGHT EMITTING DIODE LAMP TUBE |
摘要 |
A light emitting diode lamp bar (102) includes a circuit board (110), a plurality of light emitting diodes (120), heat-conducting material (130), a heat-conducting insulating layer (140) and a heat-conducting plate (150). The circuit board (110) has the first surface (112) and the second surface (114) opposite to each other. The first surface (112) has a plurality of wafer configuring regions (115) arrayed to multiple rows, and at least one heat-dissipating through hole (116) is provided in each wafer configuring region (115). The light emitting diodes (120) are arranged at the wafer configuring regions (115) one to one. The heat-conducting material (130) is filled in the heat-dissipating through holes (116) and contacts the corresponding light emitting diode (120). The heat-conducting material (130) extending from the heat-dissipating through holes (116) in the same row's wafer configuring regions (115) is connected as a whole on the second surface (114). The heat-conducting plate (150) is pasted to the second surface (114), and the heat-conducting insulating layer (140) is configured between the heat-conducting plate (150) and the circuit board (110). The light emitting diode lamp bar (102) has good heat-dissipating effect. A manufacture method of the corresponding light emitting diode lamp bar (102) and a light emitting diode lamp tube (100) including the corresponding light emitting diode lamp bar (102) are also provided. |
申请公布号 |
WO2011057433(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
WO2009CN01416 |
申请日期 |
2009.12.10 |
申请人 |
CHIANG, JUHSIANG |
发明人 |
CHIANG, JUHSIANG;CHIANG, HSUMIN |
分类号 |
F21V29/00;F21Y101/02;G09F9/33;H01L23/00;H01L23/34;H01L23/36;H01L25/075;H01L25/13;H01L33/00 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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