发明名称 LIGHT EMITTING DIODE LAMP BAR AND MANUFACTURE METHOD THEREOF, LIGHT EMITTING DIODE LAMP TUBE
摘要 A light emitting diode lamp bar (102) includes a circuit board (110), a plurality of light emitting diodes (120), heat-conducting material (130), a heat-conducting insulating layer (140) and a heat-conducting plate (150). The circuit board (110) has the first surface (112) and the second surface (114) opposite to each other. The first surface (112) has a plurality of wafer configuring regions (115) arrayed to multiple rows, and at least one heat-dissipating through hole (116) is provided in each wafer configuring region (115). The light emitting diodes (120) are arranged at the wafer configuring regions (115) one to one. The heat-conducting material (130) is filled in the heat-dissipating through holes (116) and contacts the corresponding light emitting diode (120). The heat-conducting material (130) extending from the heat-dissipating through holes (116) in the same row's wafer configuring regions (115) is connected as a whole on the second surface (114). The heat-conducting plate (150) is pasted to the second surface (114), and the heat-conducting insulating layer (140) is configured between the heat-conducting plate (150) and the circuit board (110). The light emitting diode lamp bar (102) has good heat-dissipating effect. A manufacture method of the corresponding light emitting diode lamp bar (102) and a light emitting diode lamp tube (100) including the corresponding light emitting diode lamp bar (102) are also provided.
申请公布号 WO2011057433(A1) 申请公布日期 2011.05.19
申请号 WO2009CN01416 申请日期 2009.12.10
申请人 CHIANG, JUHSIANG 发明人 CHIANG, JUHSIANG;CHIANG, HSUMIN
分类号 F21V29/00;F21Y101/02;G09F9/33;H01L23/00;H01L23/34;H01L23/36;H01L25/075;H01L25/13;H01L33/00 主分类号 F21V29/00
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