发明名称 METHOD FOR PROCESSING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for processing a minute semiconductor device, and particularly to provide a processing method suitable for miniaturization of a device having a structure normally called a high-k/metal gate. SOLUTION: An insulation film formed on a Si substrate and containing Hf or Zr and a deposited film present on the upper or lower layer thereof or in the film are removed by repeating dry etching and wet etching one or more times by putting the wet etching first. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011100822(A) 申请公布日期 2011.05.19
申请号 JP20090253910 申请日期 2009.11.05
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ONO TETSUO;MOROOKA SATORU
分类号 H01L29/78;H01L21/306;H01L21/3065;H01L21/308 主分类号 H01L29/78
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