发明名称 |
METHOD FOR PROCESSING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a minute semiconductor device, and particularly to provide a processing method suitable for miniaturization of a device having a structure normally called a high-k/metal gate. SOLUTION: An insulation film formed on a Si substrate and containing Hf or Zr and a deposited film present on the upper or lower layer thereof or in the film are removed by repeating dry etching and wet etching one or more times by putting the wet etching first. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011100822(A) |
申请公布日期 |
2011.05.19 |
申请号 |
JP20090253910 |
申请日期 |
2009.11.05 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
ONO TETSUO;MOROOKA SATORU |
分类号 |
H01L29/78;H01L21/306;H01L21/3065;H01L21/308 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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