发明名称 |
DESIGN STRUCTURE FOR INTEGRATED CIRCUIT ALIGNMENT |
摘要 |
A method and device for pattern alignment are disclosed. The device can include an exposure field; a die within the exposure field, wherein the die comprises an integrated circuit region, a seal ring region, and a corner stress relief region; and a die alignment mark disposed between the seal ring region and the corner stress relief region.
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申请公布号 |
US2011115057(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
US20090619460 |
申请日期 |
2009.11.16 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HARN YU-CHYI;WANG SOPHIA;LIN CHUN-HUNG;CHEN HSIEN-WEI;CHIU MING-YEN |
分类号 |
H01L23/544;H01L21/26;H01L21/71 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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