发明名称 Kontaktstrukturen für FinFET-Bauelement und Verfahren zur Herstellung
摘要 In accordance with an embodiment, a FinFET device includes: one or more fins, a dummy fin, a gate line, a gate contact landing pad, and a gate contact element. Each of the fins extends in a first direction above a substrate. The dummy fin extends in parallel with the fins in the first direction above the substrate. The gate line extends in a second direction above the substrate, and partially wraps around the fins. The gate contact landing pad is positioned adjacent to or above the dummy fin and electrically coupled to the gate line. The gate contact element is electrically coupled to the gate contact landing pad and is positioned to the top surface thereof.
申请公布号 DE102008025708(B4) 申请公布日期 2011.05.19
申请号 DE20081025708 申请日期 2008.05.29
申请人 INFINEON TECHNOLOGIES AG 发明人 DOBLER, BERNHARD;GEORGAKOS, GEORG
分类号 H01L29/423;H01L21/28;H01L21/336;H01L29/78 主分类号 H01L29/423
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