| 摘要 |
PURPOSE: A substrate for a ball grid array semiconductor package and a manufacturing method thereof are provided to freely control the thickness of a metal thin film by forming the metal thin film on a base substrate with a plating method. CONSTITUTION: A base substrate(10) is made of bismaleimide-triazine. Imide group or carboxyl group is generated on the surface of the base substrate by etching the surface of the base substrate. A first electroless plating layer(13) is formed on the upper side of the base substrate. A first electrolytic plating layer(14) is formed on the first electroless plating layer.
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