| 摘要 |
PURPOSE: A light emitting diode package and LCD module with the same are provided to serially connect adjacent LED chips by a lead frame, thereby preventing failure when a wire is opened. CONSTITUTION: First and second vertical LED chips(100a,100b) are composed of a first semiconductor layer, an active layer, a second semiconductor layer, and an electrode layer which are successively formed on a conductive substrate. A lead frame(220) electrically connects the first and second vertical LED chips. A case(230) is surrounded by the lead frame and is filled with fluorescent substances. A lens is located on the case and covers the first and second vertical LED chips to protect. One of the first and second vertical LED chips is connected to a power supply device by a first wire. The other one of the first and second vertical LED chips is connected to a ground power supply device by a second wire.
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