| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that, when a dicing mark is buried in a molding resin or the like, a dicing process is performed with reference to position information of the dicing mark read in advance or the like, however, the position data of the dicing mark may include a manufacturing error produced in each substrate manufacturing process to which the substrate is subjected before the dicing process, so that deterioration in dicing position accuracy is caused. <P>SOLUTION: A molding resin 61 is exposed from a recessed part 63x to form a dicing mark 63a, and a position of the recessed part 63x is observed in dicing. A manufacturing error produced in each substrate manufacturing process to which the substrate is subjected before the dicing process is corrected to perform the dicing. Since the recessed part 63x is made of a resin, a high contrast between a copper plate 1 surrounding the recessed part 63x and the recessed part 63x can be achieved, so that alignment accuracy can be improved furthermore. <P>COPYRIGHT: (C)2011,JPO&INPIT |
