发明名称 HEAT DISSIPATION STRUCTURE FOR MOTOR CONTROL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a motor control device with a structure where a heat sink is exposed outside of the device that decreases the danger of incurring burn injury, even when an operator touches the device at high temperature such as while the device is being operated or right after the device is turned off. <P>SOLUTION: The motor control device includes the heat sink where a heating element such as a power element is attached in an attaching part of a heating part. A hollow part such as a slit or helical groove is provided between the attaching part and an outer ward surface, thereby achieving the structure where heat from the heating element is less likely to transmit to the outer ward surface. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011097689(A) 申请公布日期 2011.05.12
申请号 JP20090247371 申请日期 2009.10.28
申请人 PANASONIC CORP 发明人 DOI SATORU
分类号 H02M7/48 主分类号 H02M7/48
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