| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device where accuracy in the mounting of a wafer can be improved by detecting and adjusting deviation in the mounting of the wafer in a semiconductor manufacturing process. SOLUTION: The semiconductor device manufacturing apparatus includes a chamber for treating a wafer W, a wafer stage 14 formed in the chamber and having a plurality of holes 20 for supplying gas to the rear surface of the wafer W, a gas detection mechanism for independently detecting a gas leakage amount in each of the plurality of holes 20, a wafer position detection mechanism 30 for finding out the direction and quantity of the deviation of the wafer W from a predetermined position of the wafer stage 14 based on the position of the detected hole and the amount of leakage gas, and a wafer position adjustment mechanism 32 for adjusting the position of the wafer based on the direction and quantity of the deviation from the predetermined position of the wafer stage. COPYRIGHT: (C)2011,JPO&INPIT
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