发明名称 |
Leiterplatte und elektronisches Bauteil |
摘要 |
<p>A base material in which a base insulating layer (1) and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts (2t). A hole (13h) is formed in a region under a predetermined terminal part (2t) where the base insulating layer is formed by directing a laser beam from below. A reinforcing board (4) having a through hole (4h) is attached to the lower surface of the base insulating layer (1) by a sheet-like adhesive (3B) having a through hole (13h), with the holes being aligned with one another. An opening space (TH) formed by the holes is filled with metallic paste by screen printing. In this way, a printed circuit board is fabricated. An electronic component is mounted on this printed circuit board.</p> |
申请公布号 |
DE602007013511(D1) |
申请公布日期 |
2011.05.12 |
申请号 |
DE20076013511T |
申请日期 |
2007.10.19 |
申请人 |
NITTO DENKO CORP. |
发明人 |
NISHI, KENSUKE;ITOKAWA, AKINORI;THAVEEPRUNGSRIPORN, VISIT |
分类号 |
H05K1/02;H05K3/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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