| 摘要 |
PURPOSE: A diamond wire saw is provided to increase a cutting speed using a chip pocket function by preventing the separation of diamond particles during a sawing process. CONSTITUTION: A diamond wire saw comprises a wire(10), a binder(16), and a plurality of diamond particles(14). The binder is formed in the surface of the wire. The binder is a nickel electrodeposited layer. A plurality of diamond particles is attached to the binder. The correlation of wire diameter(W), binder height(X) and diamond mean diameter(D) satisfies 0.18w<=D<=0.3w and 0.4D<=x<=0.7D. |
