| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board is provided to process a via hole in a wide area with a single process by using patterning photosensitive materials. CONSTITUTION: A base substrate(100) with a pad(110) is prepared. The photosensitive material is stacked on the base substrate to cover the pad. The photosensitive material is patterned on the upper side of the pad with a via hole shape. An insulation layer(130) is stacked on the base substrate. A via hole is formed by removing the photosensitive material.
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