| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin multilayer substrate, in which undesired deformation is hardly caused and lamination and pressing are accurately and easily performed when making a rigid-flexible multilayer wiring board. SOLUTION: The method of manufacturing the resin multilayer substrate includes steps of: making a laminate 10 having recesses 13a, 13b at least on one main surface by laminating a plurality of resin sheet elements 12 which are previously patterned in a predetermined plane shape and have a predetermined in-plane conductor pattern 11; and pressing the laminate 10 by applying pressure applying plates 30a, 30b as a plate-like tool to the laminate 10 across plate-like resin sheets 20a, 20b having projection type conductor patterns 21a, 21b, corresponding to a plane shape of the recesses, disposed on first main surfaces 22a, 22b, and pressing them. COPYRIGHT: (C)2011,JPO&INPIT |
