| 摘要 |
A wiring board has a first rigid wiring board having a substrate with a penetrating hole, a first insulation layer formed on the substrate to cover at least one opening of the penetrating hole, and a first wiring layer formed on the first insulation layer, a second rigid wiring board having a second wiring layer on a main surface and being accommodated in the penetrating hole, a first connection conductor which connects the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer.
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