发明名称 |
AN INTEGRATED PACKAGED ENVIRONMENTAL SENSOR AND ROIC AND A METHOD OF FABRICATING THE SAME |
摘要 |
An integrated packaged microchip (100) including at least one environmental sensor (104) and at least one Read-Out Integrated Chip (ROIC) (102) is provided, characterized in that, the integrated packaged microchip (100) further includes an etched opening (108) of the environmental sensor (104) exposed to a sensable environment, using at least one layer of glass wafer (101,106) and at least one layer of silicon wafer (107). |
申请公布号 |
WO2011053110(A2) |
申请公布日期 |
2011.05.05 |
申请号 |
WO2010MY00182 |
申请日期 |
2010.09.30 |
申请人 |
MIMOS BERHAD;SYONO, MOHD ISMAHADI;BIEN, DANIEL CHIA SHENG;LEE, HING WAH |
发明人 |
SYONO, MOHD ISMAHADI;BIEN, DANIEL CHIA SHENG;LEE, HING WAH |
分类号 |
G01N37/00;G01N33/00 |
主分类号 |
G01N37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|