发明名称 |
Chemical Mechanical Planarization Pad With Surface Characteristics |
摘要 |
A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane (“POSS”) molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections.
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申请公布号 |
US2011105000(A1) |
申请公布日期 |
2011.05.05 |
申请号 |
US20100891612 |
申请日期 |
2010.09.27 |
申请人 |
HU YONGQI;NARENDRNATH KADTHALA RAMAYA;BHATNAGAR ASHISH |
发明人 |
HU YONGQI;NARENDRNATH KADTHALA RAMAYA;BHATNAGAR ASHISH |
分类号 |
B24B41/00;B24D3/32;B24D3/34 |
主分类号 |
B24B41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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