发明名称 BIAS SPUTTERING DEVICE
摘要 [Object] To provide a bias sputtering device having a self-revolving mechanism capable of reducing generation of foreign substances adhered to film formation surfaces. [Solution] In a bias sputtering device 1 provided with a substrate holder 12 having a self-revolving mechanism, the substrate holder 12 has a revolving member 21 and turning holders 23, and on the side of back surfaces of substrates 14 respectively attached to the turning holders 23, disc shaped substrate electrodes 30 having the same size as the substrates 14 are provided at positions distant from the substrates 14 by 0.5 to 10 mm.
申请公布号 US2011100806(A1) 申请公布日期 2011.05.05
申请号 US20090999425 申请日期 2009.06.16
申请人 SHINCRON CO., LTD. 发明人 SUGAWARA SATOSHI;ENAMI YASUHIRO;TAKAHASHI KAZUKI;KUMAGAWA SUSUMU;JIANG YOUSONG;SHIONO ICHIRO;TAKASAKA YOSHIHIRO
分类号 C23C14/34;C23C14/50 主分类号 C23C14/34
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