| 摘要 |
PURPOSE: A die bond agent composition for an optical semiconductor element is provided to ensure excellent heat resistance, UV resistance, and adhesive property. CONSTITUTION: A die bond agent composition for an optical semiconductor element comprises (A) 100 parts by mass of silicon resin including 0.25-0.75 mole fraction of a structure unit represented by chemical formula 1 and 0.25-0.75 mole fraction of a structure unit represented by chemical formula 3, (B) 10-100 parts by mass of an epoxy resin represented by chemical formula 2, (C) a curing agent having a functional group reactive with an epoxy group, (D) curing catalyst, (E) inorganic filler, (F) silane coupling agent, and (G) oxidation inhibitor. |
