发明名称 |
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD |
摘要 |
Provided is a plasma processing apparatus including: an electrostatic chuck configured to hold a substrate inside a vacuum container, a pulse power source configured to apply a pulse having positive and negative polarities as a bias voltage and a controller configured to control the positive and negative polarities of the pulse.
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申请公布号 |
US2011097510(A1) |
申请公布日期 |
2011.04.28 |
申请号 |
US20110985004 |
申请日期 |
2011.01.05 |
申请人 |
SUMITOMO HEAVY INDUSTRIES, LTD. |
发明人 |
MAKINO HIROYUKI;TANAKA MASARU |
分类号 |
C23C14/00 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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