发明名称 DEVICE AND METHOD FOR REMOVING COATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a coating material removing device for removing a coating material from an end face of a substrate after forming the coating material on the substrate. SOLUTION: The coating material removing device includes a holding mechanism 1 holding a substrate 2 on which a coating material is formed, a removing member 4 having a wetted surface 4b opposite to a coating material removal region 2a of the substrate 2 held by the holding mechanism, and a liquid supplying mechanism supplying a cleaning liquid or an etchant to a gap 4c between the wetted surface 4b and the coating material removal region 2a of the substrate 2. The gap 4c is a gap for causing capillary action, and is filled up owing to the capillary action, with the cleaning liquid or the etchant supplied by the liquid supplying mechanism. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011086881(A) 申请公布日期 2011.04.28
申请号 JP20090240688 申请日期 2009.10.19
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 FUNO TOMOHIRO
分类号 H01L21/027;B08B3/04;G03F7/42;H01L21/304;H01L21/306 主分类号 H01L21/027
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