| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder feeding device which is capable of feeding solder with less impurities and operated for a long time. <P>SOLUTION: In the solder feeding device, ingot solder is fed to a melting tank 1 in an oxidation preventing atmosphere, the ingot solder is heated and melted in the melting tank, and molten solder L is discharged from the melting tank 1. There is provided a non-oxidizing gas feeding means 23 for feeding non-oxidizing gas in the melting tank, and a feed port 25 for feeding non-oxidizing gas into the melting tank, and an outlet 28 for exhausting the non-oxidizing gas in the melting tank outside the melting tank are provided in the melting tank 1. The non-oxidizing gas is distributed from the feed port 25 to the outlet 28 by the non-oxidizing gas feeding means 23, and the molten solder L is discharged while forming a flow passage of the non-oxidizing gas maintaining the oxidation preventing atmosphere in the melting tank in the melting tank. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
