MARKING METHOD OF SUBSTRATE AND MARKED SUBSTRATE USING THE SAME

摘要

PURPOSE: A substrate marking method and a marked substrate using the same are provided to improve the design flexibility of a substrate by not considering the correlation between the depth of the insulation layer and the etching depth. CONSTITUTION: An insulation layer(12) equipped with the opening is arranged on the base. The opening exposes a portion of the wiring pattern. An ink layer(13) of the monolayer having the color different from that of the insulating layer is formed on a portion of the insulation layer. The ink layer is heat-treated to harden the ink layer. A desired mark(M) is formed by exposing and etching the ink layer.