发明名称 LIGHT EMITTING PACKAGE STRUCTURE
摘要 PURPOSE: A light emitting diode package structure is provided to lock a transparent cover and select the position of the transparent cover by including a wall on the upper surface of the structure. CONSTITUTION: An LED package structure(10) includes a housing(12), an LED chip(14), a transparent cover, and a wall(24). The housing has an upper surface, a cavity, and a surrounding plane. The LED chip is arranged on the lower surface of the cavity. The transparent cover is arranged on the surrounding plane and seals the opening of the cavity. The surrounding wall is arranged on the upper surface of the housing and surrounds the transparent cover.
申请公布号 KR20110043468(A) 申请公布日期 2011.04.27
申请号 KR20100101084 申请日期 2010.10.15
申请人 EVERLIGHT ELECTRONICS CO., LTD. 发明人 CHOU HE MU;LI HSIAO CHIAO;HSIEH CHUNG CHUAN
分类号 H01L33/48;H01L33/54 主分类号 H01L33/48
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