发明名称 ELECTRONIC-COMPONENT HOUSING TYPE PRINTED BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic-component housing type printed board which facilitates alignment between a connection pattern and a connection terminal, has high connection reliability, and eliminates the need for separate rewiring and reduces manufacturing costs, by directly connecting the connection pattern on a flexible film with the connection terminal of an electronic component by a connecting member, and to provide a method for manufacturing the board. <P>SOLUTION: An electronic-component housing type printed board includes a flexible film 100, an insulating layer 200 laminated on one surface of the flexible film 100; an electronic component 300 which is mounted on one surface of the flexible film 100 by a facedown method and embedded in the insulating layer 200; and a circuit layer 400; that is formed on one surface of the flexible film 100 and includes a connection pattern 450 that is connected to the connection terminal 350 of the electronic component 300 by a connecting member 370. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011082471(A) 申请公布日期 2011.04.21
申请号 JP20090275331 申请日期 2009.12.03
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 WE HONG BOK;JEONG TAE SUNG;KIM DAE JUN
分类号 H05K3/46 主分类号 H05K3/46
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