| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode that sufficiently secures heat dissipation effect and can be mounted directly on the surface of a mounting substrate such as a mother board even when a high luminance type light emitting element is mounted. <P>SOLUTION: The light emitting diode 21 includes a body substrate 22 made of a metal member, a light emission part 23 formed on the body substrate 22, and a terminal electrode part 24 formed at one end of the body substrate 22, and the terminal electrode part 24 includes an upper substrate 28 and a lower substrate 30 provided on the upper surface and the lower surface of the body substrate 22 each at one end and having conductive films 28a and 30a on surfaces, an insulating layer 31 sandwiched between the upper substrate 28 and lower substrate 30 and covering the side face of the body substrate 22, and a conductive layer 32 covered such that the conductive films 28a and 30a conduct to each other via the insulating layer 31. <P>COPYRIGHT: (C)2011,JPO&INPIT |
