| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic equipment that can be improved in reliability of thermal connection. <P>SOLUTION: The electronic equipment includes, as one feature, a semiconductor package with a die, a printed wiring board on which the semiconductor package is mounted, a heat receiving plate disposed on the opposite side of the printed wiring board with respect to the die, and facing the surface of the die, and having a recess made open in smaller area than the surface of the die on the surface facing the die, and a paste-like heat conducting agent charged in a region formed between the recess and the surface of the die and expanding as the temperature rises. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
