| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high thermal conductivity and low loss factor build-up material which has excellent thermal conductivity, fluidity and heat stability and a low loss factor, reduces cost and increases yield percentage. <P>SOLUTION: The build-up material is obtained by uniformly blending an epoxy resin precursor 2, a double-curing agent compound 3, a catalyst 4, a flow modifier 5, a high thermal conductive inorganic filler 6 and a solvent 7. The epoxy resin precursor 2 is prepared by blending in a fixed ratio at least two epoxy resins selected from a trifunctional epoxy resin, a rubber-modified or dimer-acid-modified epoxy resin, a brominated epoxy resin, a halogen-free/P-contained epoxy resin, a halogen-free/P-free epoxy resin, a long-chain halogen-free epoxy resin and a bisphenol A epoxy resin. <P>COPYRIGHT: (C)2011,JPO&INPIT |
