发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CAVITY AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.
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申请公布号 |
US2011089554(A1) |
申请公布日期 |
2011.04.21 |
申请号 |
US20090582582 |
申请日期 |
2009.10.20 |
申请人 |
LEE SANG-HO;LEE TAEWOO;PARK SOO-SAN |
发明人 |
LEE SANG-HO;LEE TAEWOO;PARK SOO-SAN |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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