| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a horizontal surface mounted type LED package that combines improved heat dissipation with light weight. <P>SOLUTION: A grooved thickness-reduced recess 3 is formed on a back side of a cavity base 1, a plating layer 5C for a heat sink is exposed in the thickness-reduced recess 3, and a member such as a package substrate as a conventional example is not joined to the back side of the cavity base 1, so that the weight is greatly reduced. When each LED chip 4 mounted in a reflector recess 2 emits light and generates heat, the heat is excellently dissipated from the plating layer 5C for the heat sink exposed in the thickness-reduced recess 3 on the back side of the cavity base 1, and also excellently dissipated through a heat dissipation hole H of a substrate S from a second plating layer 5E for a pad continuous with the plating layer 5C for the heat sink and extending to a rear part of a lower surface of the cavity base 1. <P>COPYRIGHT: (C)2011,JPO&INPIT |
