SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package has: a first chip; and a second chip. The first chip has: an insulating resin layer formed on a principal surface of the first chip; a bump-shaped first internal electrode group that is so formed in a region of the insulating resin layer as to penetrate through the insulating resin layer and is electrically connected to the second chip; an external electrode group used for electrical connection to an external device; and an electrostatic discharge protection element group electrically connected to the external electrode group. The first internal electrode group is not electrically connected to the electrostatic discharge protection element group.