| 摘要 |
<p>PURPOSE: A semiconductor package is provided to easily discharge electrical noise which is generated from a semiconductor chip to outside by attaching first and second metallic layers. CONSTITUTION: In a semiconductor package, a first substrate(110) comprises a first circuit pattern(124) including a first side(110a), a second side(110b), and a bond finger(122). The second substrate(112) is attached to the outside of a chip mounting area to expose the chip mounting area to outside. A semiconductor chip(150) is attached to the chip mounting area of the first substrate. A connecting member(116) connects the first substrate and the semiconductor chip. A sealing unit(170) is filled within the chip mounting area of the first substrate including the semiconductor chip and the connecting member.</p> |
