| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of catching sputtering particles flying around a target. SOLUTION: The sputtering apparatus includes: a film-forming chamber 3 provided with a substrate holder 8 for retaining a substrate 2; a sputtering particle releasing part 4 which is connected with the film-forming chamber 3 and has a first target 12 and a second target 13 arranged opposite to each other in a housing 14; and a deposition preventive cover 25 which covers lateral surfaces of the first target 12 and the second target 13, an outer circumferential part 12c of a release surface 12a for releasing sputtering particles 31 and an outer circumferential part of a release surface 13a. COPYRIGHT: (C)2011,JPO&INPIT
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