| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a conductive base material capable of forming a conductive layer with high adhesion to a base material having a transparent conductive film and with low resistivity, even with calcination at low temperature. <P>SOLUTION: In the laminate structured of a base material having a transparent conductive film, an adhesive layer formed on the transparent conductive film, and a coating formed on the adhesive layer, the adhesive layer is structured of thermoplastic resin, and that, the coating is structured of conductive paste containing conductive particles, binder resin, and a dispersion medium. The thermoplastic resin may contain aqueous polyester resin. The conductive particles may be either metal colloid particles or a metal filler. The binder resin may be epoxy resin. A ratio of the binder resin may be around 0.1 to 3 pts.mass to 100 pts.mass of the conductive particles. The conductive base material is obtained by baking the laminate at 150 to 300°C. <P>COPYRIGHT: (C)2011,JPO&INPIT |
