| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, RESIST PATTERN-FORMING METHOD, AND METHOD FOR PRODUCING CONDUCTOR PATTERN, PRINTED WIRING BOARD, LEAD FRAME, SUBSTRATE WITH UNEVEN PATTERN AND SEMICONDUCTOR PACKAGE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in sensitivity, resolution and interface adhesion of a resist hem and ensures small size of stripped pieces in stripping and good treatability of waste liquid. <P>SOLUTION: The photosensitive resin composition comprises: (a) a thermoplastic polymer polymerized from a polymerizing component including an α,β-unsaturated carboxyl group-containing monomer, the polymer having a specific acid equivalent and a specific weight average molecular weight; (b) an addition polymerizable monomer having at least one polymerizable ethylenically unsaturated bond in a molecule; and (c) a photoinitiator, each in a specific amount, wherein (a-1) a polymer having a weight average molecular weight of 15,000-85,000 and (a-2) a polymer having a weight average molecular weight of 150,000-400,000 are included as the thermoplastic polymer (a) in a polymer (a-1) to (a-2) mass ratio of 1-3, and wherein a proportion of a polymerizing component containing an aromatic group to the above polymerizing component is ≤10 mass%. <P>COPYRIGHT: (C)2011,JPO&INPIT |
