| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for peeling a protective tape, preventing the pollution and damage of a circuit pattern and an electrode formed on the surface of a chip portion, after dicing. SOLUTION: A chip portion CP divided into portions by dicing-treating a wafer-bonded and held to an adhesive tape DT for a mount frame MF is shifted at the mounting place of a substrate GW on a substrate holding stage 36 through, sucking by a tape peeling mechanism 4, and the protective tape T stuck on the surface of the chip portion CP at the mounting place and losing adhesion by foam-expansion by heating is heated by a heater via a head. The tape-peeling mechanism 4 is elevated while the protective tape PT is sucked; and the protective tape T is peeled and removed from the chip portion CP. COPYRIGHT: (C)2011,JPO&INPIT |
